Designed where it's built.

The IC Design Center is the intellectual starting point of the platform: the team that turns system requirements into silicon. Its charter spans four product families — analog ICs for precision signal processing and power management, mixed-signal devices with data converters and interfaces, digital logic and ASICs, and microcontrollers for embedded and automotive control.

Co-location with the wafer fab is the deliberate architectural choice. Designers work against the frontend’s process design kits from day one, so parasitics, thermal behavior and process variation are modeled with the fab’s own data instead of generic assumptions. When silicon comes back from the fab, characterization engineers sit close enough to the line to correlate a device mismatch with a process split within hours.

The design flow is industrial, not artisanal: architecture and specification, simulation across corners, full-custom and standard-cell layout, then verification — DRC, LVS, ERC and formal equivalence — before any tape-out package is handed to the fab. Reusable IP (ADCs, DACs, amplifiers, regulators, MCU subsystems) shortens every new derivative, and the same team supports silicon validation through to production release.